PDF "Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly, and Applications for Injection Molded Circuit Carriers - Jorg Franke"

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Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly, and Applications for Injection Molded Circuit Carriers
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Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies.